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Non-Ferrous Application Series

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Non-Ferrous Application Series

Non-Ferrous Application Series

Complete turning solutions for non-ferrous materials

The ultimate tools for high speed machining of non-ferrous alloys.
Chip nesting is a thing of the past.

Non-Ferrous Application Series

Applications & Features

Applications

External turningInternal turning

Features

Ultra-fine grained PCD-tipped inserts

DX110

Definitive insert series for high speed machining of aluminum alloys

  • Ultra-fine grained PCD grade for edge sharpness
  • An extremely wear-resistant grade, featuring strongly-bonded diamond grains that prevents the grains from breaking off during machining
  • Thanks to ultra-fine diamond grains, DX110 provides superior surface finish
  • Chipbreaker series with rake angle of 10°

 

1. Grade selection guide

Grade selection guide

 

2. PCD grades and applications

PCD inserts with 3D chipbreaker

NS

No more chip nesting in aluminum alloy machining

Unique 3D chipbreaker

  • Versatile geometry allows excellent chip control
  • One insert handles from rough to finish operations
  • Optimal rake angle design effectively directs chips to the redirector

PCD inserts with 3D chipbreaker

Fine-grained cemented carbide inserts with chipbreaker for non-ferrous alloy

AL / 28 / P

No more chip nesting in aluminum alloy and copper alloy machining

For positive insert

First-choice geometry for non-ferrous applications
AL

AL Chipbreaker

  • Provides excellent chip control and resistance to wear and built-up edge
  • Low cutting forces generated by a large rake angle and sharp cutting edge
  • 3D geometry with lapped rake face
  • Superb chip control enabled by large inclination angle of the cutting edge
  • Available on 26 total inserts, including CCGT, DCGT, RCGT, TCGT, and VCGT inserts

 

For negative insert

Press-in chipbreaker ideal for medium to finish operations
28

28 Chipbreaker

  • Versatile geometry with a large inclination angle of the cutting edge. Ideal for medium to finish operations
  • Provides superior surface finish and chip control

 

Linear chipbreaker
P

P chipbreaker
Provides process security across a wide range of applications

Grades

DX110

  • Excellent sharpness for high surface quality
  • Suitable for finishing non-ferrous metal and nonmetal

KS05F

  • N15
  • Uncoated cemented carbide

Practical examples

Example #1

Automotive Industry

Part: Con-rods
Material: Copper-based sintered alloy
Insert: 1QP-CCMT09T304, 1QP-CCMT32.51
Grade: DX110
Cutting conditions: Vc = 300 (m/min)
f = 0.05 (mm/rev)
ap = 0.1 (mm)
Coolant: Wet
Example #2
Part: Transmission parts
Material: A2011 / AlCu6BiPb
Insert: 1QP-VCGT160404-NS
Grade: DX110
Cutting conditions: Vc = 1,400 (m/min)
f = 0.08 (mm/rev)
ap = 0.1 (mm)
Coolant: Wet
Example #3
Part: Pipe
Material: A5052S / AlMg2.5
Insert: 1QP-DCGT11T304-NS
Grade: DX110
Cutting conditions: Vc = 400 (m/min)
f = 0.1 (mm/rev)
ap = 1 (mm)
Coolant: Wet

Standard cutting conditions

ISO Workpiece materials Chipbreaker Grade Cutting speed
Vc (m/min)		 Feed
f (mm/rev)		 Depth of cut
ap (mm)
Aluminum alloys
(Si ≤ 12%)		 NS DX110, DX160 300 – 2500 0.03 – 0.3 0.1 – 2
Without DX110, DX120,
DX140, DX160		 300 – 2500 0.05 – 0.2 0.05 – 2
AL KS05F 100 – 1200 0.1 – 0.5 0.05 -5
28 KS05F 100 – 1200 0.1 – 0.5 0.5 – 3
P TH10 100 – 1000 0.2 – 0.5 0.5 – 4
JP KS05F 100 – 1200 0.02 – 0.1 0.05 – 2.5
JS KS05F 100 – 1200 0.02 – 0.2 0.5 – 3
Aluminum alloys
(Si ≥ 12%)		 NS DX110, DX160 300 – 800 0.03 – 0.2 0.1 – 2
Without DX110, DX120,
DX140, DX160		 300 – 800 0.05 – 0.2 0.05 – 2
Without DX120 400 – 800 0.05 – 0.2 0.05 – 2
Without DX140 400 – 800 0.05 – 0.2 0.05 – 2
Without DX160 400 – 800 0.05 – 0.2 0.05 – 2
AL KS05F 100 – 300 0.1 – 0.5 0.5 – 5
28 KS05F 100 – 300 0.1 – 0.5 0.5 – 3
P TH10 100 – 300 0.2 – 0.5 0.5 – 4
JP KS05F 100 – 1200 0.02 – 0.1 0.05 – 2.5
JS KS05F 100 – 300 0.02 – 0.2 0.5 – 3
Copper and copper alloys NS DX110, DX160 300 – 1500 0.03 – 0.3 0.1 – 2
Without DX110, DX120,
DX140, DX160		 300 – 1500 0.05 – 0.2 0.05 – 2
AL KS05F 100 – 300 0.1 – 0.5 0.5 – 5
28 KS05F 100 – 300 0.1 – 0.5 0.5 – 3
P TH10 100 – 300 0.2 – 0.5 0.5 – 4
JP KS05F 100 – 300 0.02 – 0.1 0.05 – 2.5
JS KS05F 100 – 300 0.02 – 0.2 0.5 – 3
Magnesium alloys Without DX110, DX120,
DX140, DX160		 400 – 1200 0.05 – 0.2 0.05 – 1
FRP Without DX160, DX200 500 – 1000 0.05 – 0.3 0.1 – 1
CFRP Without DX160, DX200 100 – 700 0.05 – 0.3 0.1 – 1
Carbon Without DX160, DX200 300 – 500 0.05 – 0.3 0.1 – 1
Green ceramics Without DX160, DX200 100 – 200 0.02 – 0.1 0.1 – 1
Tungsten carbide (HRA80 – 95) Without DX160, DX200 5 – 30 0.02 – 0.1 0.02 – 0.2
Sputtering targets for semiconductor Without DX200 10 – 100 0.02 – 0.1 0.02 – 0.2

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